BU14OZ-178-HT
Part number
BU14OZ-178-HT
Product Category
IC Sockets
Manufacturer
On Shore Technology Inc.
Description
CONN IC DIP SOCKET 14POS GOLD
Encapsulation
Tube
Packing
Quantity
1600
RoHS status
NO
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Quantity
Price
Total price
Part Status
Obsolete
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 125°C
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Pitch - Post
0.100" (2.54mm)
Material Flammability Rating
UL94 V-0
Termination
Solder
Type
DIP, 0.3" (7.62mm) Row Spacing
Contact Material - Mating
Beryllium Copper
Features
Open Frame
Contact Material - Post
Brass
Number of Positions or Pins (Grid)
14 (2 x 7)
Current Rating (Amps)
1 A
Housing Material
Polybutylene Terephthalate (PBT), Glass Filled
Contact Finish Thickness - Mating
78.7µin (2.00µm)
Contact Finish - Post
Copper
Contact Finish Thickness - Post
Flash
Termination Post Length
0.059" (1.50mm)
Contact Resistance
7mOhm
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