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130-028-000

Part number 130-028-000
Product classification IC Sockets
Manufacturer 3M
Description CONN IC DIP SOCKET 28POS GOLD
Encapsulation
Packing Bulk
Quantity 0
RoHS status NO
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Product parameters
TYPEDESCRIPTION
Mfr3M
Series100
PackageBulk
Product StatusOBSOLETE
FeaturesOpen Frame
Mounting TypeThrough Hole
TypeDIP, 0.3" (7.62mm) Row Spacing
Operating Temperature-65°C ~ 125°C
Number of Positions or Pins (Grid)28 (2 x 14)
TerminationSolder
Material Flammability RatingUL94 V-0
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating8.00µin (0.203µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - PostFlash
Contact Material - PostBrass
Termination Post Length0.126" (3.20mm)
Current Rating (Amps)1 A

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